The ARCTIC MX-4 compound is composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated quickly and efficiently. Superb in performance, MX-4 is the best companion for overclockers and enthusiasts.

Kryonaut thermal grease was created especially for the extremely demanding applications and the highest expectations of the overclocking community. Kryonaut is also highly recommended as a top product for critical cooling systems in the industrial environment. Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus guaranteeing remarkable heat transfer.

Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide.

NT-H2 is the further improved second generation of Noctua’s award-winning hybrid thermal compound. Combining the iconic NT-H1’s proven features, superb ease-of-use and renowned long-term stability with a novel, fine-tuned formula of micro particles for even better thermal performance, NT-H2 is an enthusiast-grade paste for the highest demands.

Thermal grease from Thermal Grizzly working on the basis of liquid metal provides all high efficiency, which ensures efficient heat transfer between the CPU and the heat sink. This is possible thanks to a mixture of tin, gallium and indium. It caters to high thermal conductivity, making it'll get better stability of its entire system and also increase the life of the components.

With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, provides a new level of performance and stability, optimized for a wide range of bond lines between modern high-power CPUs and high performance heatsinks or water-cooling solutions, Contains 99.9% pure silver